Ningbo Jinshengxin Imaging Technology Co., Ltd. (hereinafter referred to as "Jinshengxin") was established in 2016, with its origins tracing back to a module business division founded in 2012.
The company specializes in the R&D, design, and manufacturing of camera modules, with products spanning a wide range of applications including notebook modules, automotive imaging, security surveillance, facial recognition, barcode scanning, 3D structured light, and 3D TOF.
Leveraging over a decade of technological expertise and supply chain integration capabilities, Jinshengxin has grown into an imaging module manufacturer with annual sales exceeding RMB 200 million. The company's campus covers an area of 50,000 square meters, with 10,000 square meters dedicated to production and office space. It currently employs more than 400 staff members and maintains branch offices in Shanghai and Shenzhen, continuously providing products and services to domestic and international clients across sectors such as industrial PADs, laptops, barcode scanners, facial payment terminals, and IoT devices.
The company has earned numerous authoritative qualifications and honors. It has been recognized as a National High-Tech Enterprise, established long-term strategic partnerships with key clients, and obtained multiple system certifications, including those for automotive quality management, environmental management, occupational health and safety, intellectual property management, and the integration of informatization and industrialization.
Looking ahead, Jinshengxin will continue to deepen its engagement in the image sensing field. Through sustained technological innovation and reliable delivery capabilities, we aim to help customers enhance both imaging performance and production efficiency.
Committed to our vision of "Bringing Vision to Machines, Enriching the World We See," we strive to earn enduring global trust in Chinese manufacturing through unwavering quality in the era of intelligent transformation.
Jinshengxin adheres to the "technology-oriented, innovation-driven" business model, and has set up R&D centers in Zhejiang, Shanghai, Shenzhen and other places in China. R&D team in the field.
Based on the professional technology accumulated in the camera module packaging and testing industry for many years, the company is one of the first few companies in China to adopt chip-on-board package (COB) and film-on-chip package (COF) technology in the manufacture of camera modules, and can mass produce and sell It is one of the manufacturers of 1Mage to 180 million-pixel ultra-thin cameras and dual/multi-camera modules, and is also the first manufacturer in China to mass-produce 3D structured light modules and 3D TOF modules. High-end OEM NB module manufacturers; there are both ODM and OEM, and the two sides cooperate to develop new camera module manufacturers.
Guided by a technology-oriented and innovation-driven development philosophy, Jinshengxin has established an R&D center in Zhejiang and branch offices in Shenzhen and Shanghai. The company has assembled a global, cross-disciplinary R&D team comprising top-tier industry experts.
Deeply engaged in the packaging and testing of camera modules, Jinshengxin has mastered core processes such as COB and COF. Its mass production capabilities span ultra-thin modules ranging from 1MP to 108MP, as well as dual- and multi-camera modules. In the field of 3D sensing, the company has achieved volume production of structured light and TOF modules, and provides specialized module OEM services for high-end laptops.
The company’s business models encompass ODM, OEM, and joint development, fostering collaborative innovation with its clients. Concurrently, Jinshengxin is expanding into high-end packaging and testing, covering package types including iLCC, iBGA, PLGA, and PLCC. It is currently advancing the construction of an integrated production line for wafer grinding, dicing, testing, and packaging, aiming to build a comprehensive, full-chain packaging and testing manufacturing platform.
